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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays . 1/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 tsz22111 ? 14 ? 001 www.rohm.com datashee t _ _ _ led drivers for lcd backlights white led driver for large lcd panels (dcdc converter type) bd9394fp, bd9394efv general description bd9394fp, bd9394efv is a high efficiency driver for white leds and designed for large lcds. this ic is built-in a boost dcdc converters that employ an array of leds as the light source. bd9394fp, bd9394efv has some protect function against fault conditions, such as the over-voltage protection (o vp), the over current limit protection of dcdc (ocp), the short circuit protection (scp), the open detection of led string. therefore bd9394fp, bd9394efv is available for the fail-safe design over a wide range output voltage. key specification ? operating power supply voltage range: 9.0v to 35.0v ? led minimum current 30ma ? led maximum current: 150ma ? oscillator frequency: 150khz (rt=100k ) ? operating current: 4.5ma (typ.) operating temperature range: -40 to +85 applications tv, computer display, notebook, lcd backlighting package w(typ.) x d(typ.) x h(max.) hsop20 14.90mm x 7.80mm x 2.10mm htssop-b24 7.80mm x 7.60mm x 1.00mm features ? 4ch led constant current driver and dc/dc converter ? maximum led current: 150ma ? led feedback voltage: 0.37v (@nadim=2.62v), so lower heat. adjustable feed back voltage by following led current setting. ? ? 2% led current accuracy (nadim=2.62v, when each led is set to 100ma) ? analog current (linear) dimming at nadim pin ? led pin rating 60v ? individual detection and individual led off for both open and short circuits ? built-in iset pin short-circuit protection circuit ? set soft-start time by external capacitor. ? fets gate (n pin) is driven by 5.8v swing ? built-in vout discharge circuit for shutdown ? built-in vout overvoltage protection (ovp) / reduced voltage protection (scp) circuit ? adjustable led short protection voltage by lsp terminal ? hsop20, htssop-b24 package with high heat radiation efficiency typical application circuit (4 light with pwm) fig.1(a) hsop20 fig.1(b) htssop-b24 fig.2 typical application circuit downloaded from: http:///
datasheet datasheet 2/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv _ _ absolute maximum ratings (ta=25 ) parameter symbol ratings unit power supply voltage vcc 36 v stb, nadim, ovp, pwm terminal vo ltage stb, nadim, ovp, pwm vcc v led1 to 4 terminal voltage led1~4 60 v auto, reg58, cs, n, lsp, iset, ss, fb, rt terminal voltage auto, reg58, cs, n, lsp, iset, ss, fb, rt 7 v power dissipation 1(hsop20) pd1 2.18 *1 w power dissipation 2(htssop-b24) pd2 4.00 *2 w operating temperature range topr -40~+85 storage temperature range tstg -55~+150 junction temperature tjmax 150 *1 ta = 25c or more, diminished at -17.4mw/c in the case of hsop20 (when 4-layer / 70.0 mm x 70.0 mm x 1.6 mm board is mounte d) *2 ta = 25c or more, diminished at -32.0mw/c in the case of htssop-b24 (when 4-layer / 70.0 mm x 70.0 mm x 1.6 mm board is mo unted) operating ratings (ta = 25 ) parameter symbol limits unit vcc supply voltage vcc 9.0~35.0 v min. output current of led1 to 4 iled_min 30 ma *1 max. output current of led1 to 4 iled_max 150 ma *1,2 min. output current of led1 to 4 vnadim1 0~5.0 *3 v max. output current of le d1 to 4 vnadim2 7.0~35.0 v dc/dc oscillation frequency vlsp 0.8 3.0 v dc/dc oscillation frequency fsw 100~800 khz min. on-duty time for pwm light modulation pwm_min 30 us *1 the amount of current per channel. *2 if led makes significant variations in its reference voltage, the driver will increase power dissipation, resulting in a rise in package temperature. to avoid this problem, design the board with t horough consideration given to heat radiation measures. *3 the range which the led current changes with linearity is from 1.5v to 5v. pin configuration hsop20 fig.3 pin configuration htssop-b24 downloaded from: http:///
datasheet datasheet 3/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv marking diagram and physical dimension electrical characteristics (unless otherwise noted, ta = 25 o c, vcc=24v) parameter symbol limit unit condition min. typ. max. [whole device] circuit current while in operation icc - 4.5 9 ma stb=3v,pwm=3v,rt=100k ? circuit current while in standby istb - 40 80 a stb=0v [reg58 block] reg58 output voltage reg58 5.742 5.8 5.858 v io=0ma soft start completion voltage ireg58 15 - - ma [uvlo block] uvlo release voltage vuvlo_vcc 6.5 7.5 8.5 v vcc=sweep up uvlo hysteresis voltage vuhys_vcc 150 300 600 mv vcc=sweep down [dc/dc block] error amp. reference voltage vled 0.35 0.37 0.39 v iset=75k , nadim=2.62v oscillation frequency fsw 142.5 150.0 157.5 khz rt=100kohm max. duty cycle per output of n pin dmax 83 90 97 % rt=100kohm on resistance on n pin source side ronh - 4 8 ? ion=-10ma on resistance on n pin sink side ronl - 3 6 ? ion=10ma ss pin source current issso -4 -2 -1 ua vss=2v soft start completion voltage vss_end 3.3 3.7 4.1 v ss=sweep up fb sink current ifbsink 50 100 150 a led=2.0v, vfb=1.0v fb source current ifbsource -150 -100 -50 a led=0v, vfb=1.0v over current detection voltage vcs 0.40 0.45 0.50 v cs=sweep up d9394efv lot no. fig.4 physical dimension bd9394fp lot no. hsop20 htssop-b24 downloaded from: http:///
datasheet datasheet 4/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv electrical characteristics (unless otherwise noted, ta = 25 o c, vcc=24v) parameter symbol limit unit condition min. typ. max. [dc/dc protection block] overvoltage protection detection voltage vovp 2.7 3.00 3.3 v vovp=sweep up overvoltage protection detection hysteresis voltage vovp_hys 50 100 200 mv vovp=sweep down short circuit protection detection voltage vscp 0.04 0.10 0.25 v vovp=sweep down [led driver block] led pin current accuracy 1 diled1 -2 - 2 % iled=100ma, (vnadim=2.62v,riset=75k ) led pin current accuracy 2 diled2 -3 - 3 % iled=100ma, (vnadim=7v,riset=75k ) led pin leakage current illed -2.5 - 2.5 ua vled=60v led open detection voltage vopen 0.05 0.2 0.285 v vled=sweep down led short detection voltage vshort 4 5 6 v vled=sweep up, vlsp=open lsp pin resistive divider upper side resistance rulsp 1000 2000 3000 k ? vlsp=0v lsp pin resistive divider lower side resistance rdlsp 500 1000 1500 k ? vlsp=3v nadim pin input current ilnadim -2.5 - 2.5 ua vnadim=5v [stb block] stb pin high-level voltage stbh 2 - 35 v stb=sweep up stb pin low-level voltage stbl -0.3 - 0.8 v stb=sweep down stb pin pull-down resistance rstb 500 1000 1500 k ? vstb=3.0v [pwm block] pwm pin high-level voltage pwmh 2 - 35 v pwm=sweep up pwm pin low-level voltage pwml -0.3 - 0.8 v pwm= sweep down pwm pin pull-down resistance rpwm 180 300 420 k ? pwm=3.0v [failure indication block (open drain)] auto pin source current iauto -2 -1 -0.5 a vauto=2v auto pin detection voltage vauto 3.6 4.0 4.4 v vauto=sweep up abnormal detection timer tcp 20 ms rt=75k ? downloaded from: http:///
datasheet datasheet 5/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv pin descriptions (bd9394fp) pin no pin name in/out function rating [v] 1 auto out auto-restart time setting pin -0.3 ~ 7 2 reg58 out power supply for n pin -0.3 ~ 7 3 cs in dc/dc output current detection and ocp detection pin -0.3 ~ 7 4 n in dc/dc switching output pin -0.3 ~ 7 5 dcdc_gnd - power gnd pin - fin1 gnd - analog gnd pin - 6 lsp in led short detection voltage setting resistor connection pin -0.3 ~ 7 7 ovp in overvoltage protection detection pin -0.3 ~ 36 8 led1 out output pin 1 for led -0.3 ~ 60 9 led2 out output pin 2 for led -0.3 ~ 60 10 led_gnd - ground pin for led - 11 stb in enable pin -0.3 ~ 36 12 led3 out output pin 3 for led -0.3 ~ 60 13 led4 out output pin 4 for led -0.3 ~ 60 14 pwm in external pwm light modulation signal input pin for led1-4 -0.3 ~ 36 15 iset out led current setting resistor connection pin -0.3 ~ 7 fin2 gnd - analog gnd pin - 16 ss out soft start pin / led protection masking time setting pin. -0.3 ~ 7 17 fb in/out error amp output pin -0.3 ~ 7 18 rt out dc/dc drive frequency setting resistor connection pin. -0.3 ~ 7 19 nadim in analog dimming dc voltage input pin -0.3 ~ 36 20 vcc in power supply pin -0.3 ~ 36 pin descriptions (bd9394efv) pin no pin name in/out function rating [v] 1 auto out auto-restart time setting pin -0.3 ~ 7 2 reg58 out power supply for n pin -0.3 ~ 7 3 cs in dc/dc output current detection and ocp detection pin -0.3 ~ 7 4 n in dc/dc switching output pin -0.3 ~ 7 5 dcdc_gnd - power gnd pin - 6 lsp in led short detection voltage setting resistor connection pin -0.3 ~ 7 7 ovp in overvoltage protection detection pin -0.3 ~ 36 8 led1 out output pin 1 for led -0.3 ~ 60 9 led2 out output pin 2 for led -0.3 ~ 60 10 n.c. - unconnected pin. - 11 led_gnd - ground pin for led - 12 n.c. - overvoltage pr otection detection pin. - 13 stb in enable pin -0.3 ~ 36 14 led3 out output pin 3 for led -0.3 ~ 60 15 n.c. - dc/dc switching output pin. - 16 led4 out output pin 4 for led -0.3 ~ 60 17 pwm in external pwm light modulation signal input pin for led1-4 -0.3 ~ 36 18 iset out led current setting resistor connection pin -0.3 ~ 7 19 gnd - analog gnd pin - 20 ss out soft start pin / led protection masking time setting pin. -0.3 ~ 7 21 fb in/out error amp output pin -0.3 ~ 7 22 rt out dc/dc drive frequency setting resistor connection pin. -0.3 ~ 7 23 nadim in analog dimming dc voltage input pin -0.3 ~ 36 24 gnd - ground pin for analog block. - downloaded from: http:///
datasheet datasheet 6/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv pin esd type fig. 5 pin esd type reg58 / n / dcdc_gnd / cs nadim fb led1~4, led_gnd rt ss _ pwm iset lsp ovp auto stb downloaded from: http:///
datasheet datasheet 7/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv block diagram fig. 6 block diagram downloaded from: http:///
datasheet datasheet 8/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv typical performance curve fig.8 n frequency [mhz] vs. r_rt [m ] 90 92 94 96 98 100 102 104 106 108 110 -40 -20 0 20 40 60 80 temp[ ] iled[ma] 0 20 40 60 80 100 120 140 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 nadim[v] iled[ma] 3 4 5 6 7 8 9 10 9 1 41 92 42 93 4 vcc[v] icc[ma] fig.7 operating current (icc) [ma] vs. vcc[v] fig.9 led current (iled) [ma] vs. temp [ ] fig.10 led current (iled) [ma] vs. nadim [v] vcc=24v iset=75k 10 100 1000 10 100 1000 rrt[kohm] fsw [ khz ] downloaded from: http:///
datasheet datasheet 9/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv pin function auto (hsop20:1pin / htssop-b24 1pin) this sets up time till auto-restart time from the point of abnormal detection. having 1ua constant current charge at external capacitor connected to auto pin, it will start again when it becomes over 4.0v (the auto pin is shorted to gnd, this ics protection function operates latched off mode). auto-restart period vs. auto capacitance (ideal) reg58 (hsop20:2pin / htssop-b24 2pin) the reg58 pin is used in the dc/dc converter driver block to output 5.8v power. the maximum operating current is 15ma. using the reg58 pin at a current higher than 15ma can affect the n pin output pulse, causing the ic to malfunction and leading to heat generation of the ic itself. to avoid this problem, it is recommended to make load setting to the minimum level. please place the ceramic capacitor connected to reg58 pin (2.2uf 10uf) closest to reg58-gnd pin. cs (hsop20:3pin / htssop-b24 3pin) the cs pin has the following two functions: 1. dc/dc current mode current feedback function current flowing through the inductor is converted into volta ge by the current sensing resistor rcs connected to the cs pin and this voltage is compared with voltage set with the error amplifier to control the dc/dc output voltage. 2. inductor current limit function the cs pin also incorporates the over current protection (o cp) function. if the cs pin voltage reaches 0.45v (typ.) or more, switching operation will be forcedly stopped. n (hsop20:4pin / htssop-b24 4pin) the n pin is used to output power to the external nmos gate driver for the dc/dc converter in the amplitude range of approx. 0 to reg58. on resistances is 4.0 (typ.) in sorrce (h side), 3.0 (typ.) in sink (l side). frequency setting can be made with a resistor connected to the rt pin. for details of frequency setting, refer to the description of the rt pin. dcdc_gnd (hsop20:5pin / htssop-b24 5pin) the pgnd pin is a power ground pin for the driver block of the output pin n. gnd (hsop20:fin1, fin2 / htssop-b24 19pin) the gnd pin is an internal analog circuit ground of the ic. lsp (hsop20:6pin / htssop-b24 6pin) terminal which sets led short detection voltage; the short detection voltage is in a proportional relationship to lsp set voltage and is set by the following equation: led short led detection voltage vlsp lsp setting voltage lsp setting voltage should be made in the range of 0.8 to 3.0v. set at 5 v (typ.) when lsp = open. ] [ 5 v vlsp led short ? ? [sec] 10 0.4 ] [ 10 0.1 ] [0.4 6 6 auto auto auto c a c v t ? ? ? ? ? ? ? downloaded from: http:///
datasheet datasheet 10/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv ovp (hsop20:7pin / htssop-b24 7pin) the ovp pin is an input pin for over-voltage protection and short circuit protection of dc/dc output voltage. if over-voltage is detected, the ovp pin will stop the dc/dc converter conducting step-up operation. when the short circuit protection (scp) function is activated, the dc/dc converte r will stop operation, and then the timer will start counting. when the timer completes counting the preset period of time, the led drivers are stopped. the ovp pin is of the high impedance type and involves no pull-down resistor, resulting in unstable potential in the open-circuited state. to avoid this problem, be sure to make input voltage setting with the use of a resistive divider or otherwise. led1 C led4 (hsop20:8,9,12,13pin / htssop-b24 8,9,14,16pin) the led1 to 4 pins are used to output constant current to led drivers. current value setting can be made by connecting a resistor to the iset pin. for the current value setting procedure, refer to the description of iset pin. if any of the led pins is put in an erroneous state (e.g. short circuit mode, open circuit mode, or ground short circuit mode), the relevant protection function will be activated. led_gnd (hsop20:10pin / htssop-b24 11pin) the led_gnd pin is a power ground pin used for the led driver block. stb (hsop20:11pin / htssop-b24 13pin) the stb pin is used to make setting of turning on and off the ic and allowed for use to reset the ic from shutdown. note: the ic state is switched (i.e., the ic is switched between on and off state) according to voltages input in the stb pin. avoid using the stb pin between two states (0.8 to 2.0v). pwm (hsop20:14pin / htssop-b24 17pin) the pwm pin is used to turn on and off led drivers. light can be modulated by changing the duty cycle through the direct input of a pwm light modulation signal the high and low voltage levels of pwm pin is as listed in the table below: state pwm voltage led on ?B pwm= 2.0v~35v led off ?B pwm= 0.3v 0.8v iset (hsop20:15pin / htssop-b24 18pin) the iset pin is an output current setting resistor. output current iled varies in inverse proportion to resistance. the relation between output current iled and the resistance of iset pin connection resistor riset is given by the following equation: (nadim=0~5v) (nadim>7v~35v) output current setting should be made in the range of 30 to 150ma. it prepares automatically to suitable led feedback voltage that can output led current set by iset pin. in short led feedback voltage is dropped when the led curr ent is small and the ic heating is held automatically. in case of a large current is needed, raise the led pin feedback voltage. and it adjusts automatically to led pin voltage that can be flow large led current. the calculation is as below. the led feedback voltage (vled) is clamped to 0.3v (typ.) when the led current (iled) is less than 81.1ma. nadim input range is from 0v to 5v. and the range which t he led currents change with linearity is from 1.5v to 5.0v. when it reaches under viset 0.90v(typ), the led current is off to prevent from passing a large current to the led pin when the riset is shorted and the iset pin is shorted to the gnd. and as the iset pin returns to a normal state, the led current returns. ] [ 7500 ] [ k r ma i iset led ? 3 ] [ 12.7 ] [ 5000 ] [ v v k r ma i nadim iset led ? ? ? ][ ][ 7.3 v a i vled led ? ? downloaded from: http:///
datasheet datasheet 11/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv ss (hsop20:16pin / htssop-b24 20pin) the ss pin is used to make setting of soft start time and duty for soft start. it performs constant current charge of 2.0 ua to the external capacitor connected with ss terminal, which enables soft-start of dc/dc converter. since the led protection function (open/short detection) works when the ss terminal voltage reaches 3.7 v (typ.) or higher, it must be set to bring stability to conditions such as dc/dc output voltage and led constant current drive operation, etc. before the voltage of 3.7 v is detected. fb (hsop20:17pin / htssop-b24 21pin) the fb pin is an output pin used for dc/dc current mode control error amplifier. in other words, the fb pin detects the voltages of led pins (1 to 4) and controls inductor current so that the pin voltage of the led located in the row with the highest vf will come to 0.37v (nadim=( 2.62)v, iled=100ma). as a result, the pi n voltages of other leds become higher by vf variation. after completion of soft start, the fb pin is put into the high-impedance state with the pwm signal being in the low state, thus maintaining the fb voltage. rt (hsop20:18pin / htssop-b24 22pin) the rt pin is used to connect a dc/dc frequency setting resistor. dc/dc drive frequency is determined by connecting the rt resistor. ? drive frequency vs. rt resistance (ideal) when rt is 100k , fsw is 150khz(typ.). however, drive frequency setting should be made in the range of 100 khz to 800 khz. nadim (hsop20:19pin / htssop-b24 23pin) nadim pin is for analog dimming. output current is proportionality with input voltage (negative). basically, nadim pin assumes the voltage inputted externally using high accuracy of resistive divider and etc., ic internally is in open (high impedance) condition. please be sure to apply externally for resistive divider and etc. from reg58 output. cannot use in an open condition . vcc (hsop20:20pin / htssop-b24 24pin) the vcc pin is used to supply power for the ic in the range of 9 to 35v. if the vcc pin voltage reaches 7.5v (typ.) or more, the ic will initiate operation. if it reaches 7.2v (typ.) or less, the ic will be shut down. ] [ ] [ 15000 ? ? k khz f r sw rt downloaded from: http:///
datasheet datasheet 12/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv startup operation and soft start (ss) capacitance setting the following section describes the sequence for the startup of this ic. ? description of startup sequence (1) set the stb and pwm pin to on. (2) set sll systems to on, ss charge will be initiated. at this time, a circuit in which ss pin voltage for soft start becomes equal to fb pin voltage operates to equalize the fb pin and ss pin voltages regardless of whether the pwm pin is et to low or high level. (3) since the fb pin and ss pin reach the lower limit of the internal sawtooth wave of the ic, the dc/dc converter operates to start vout voltage rising. (4) the vout voltage continues rising to reach a voltage at which led current starts flowing. (5) when the led current reaches the set amount of current, isolate the fb circuit from the ss circuit. with this, the startup operation is completed. (6) after that, conduct normal operation following the feedback operation sequence with the led pins. if the ss pin voltage reaches 3.7v or more, the led protection function will be activated to forcedly end the ss and fb equalizing circuit. ? ss capacitance setting procedure as aforementioned, this ic stops dc/dc converter when the pwm pin is set to low level and conducts step-up operation only in the section in which the pwm pin is maintained at high level. consequently, setting the pwm duty cycle to the minimum will extend the startup time. the startup time also varies with application settings of output capacitance, led current, output voltage, and others. startup time at minimum duty cycle can be approximated according to the following method: make maeasurement of vout startup time with a 100% duty cycle, first. take this value as trise100. the startup time trise_min for the relevant application with the minimum duty cycle is given by the following equation. ] [ ] [ _ ] [ 100_ min _ sec ratio duty min sec t t rise rise ? however, since this calculation method is just for approximation, use it only as a guide. make setting of time during which the ss pin voltage reaches the fb pin voltage longer than this startup time. assuming that the fb pin voltage is vfb, the time is given by the following equation: ] [ ] [2 ][ ][ sec a v vfb f c t ss ss ? ? ? as a result, it is recommended to make ss capacitance setting so that tss will be greater than trise_min _ = _ downloaded from: http:///
datasheet datasheet 13/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv ? about unused led terminal automatic detecting function this ic is detected automatical ly that it is an unused channel by asssuming t he led terminal to be open at starting. it explains the sequence. sequence; stb=on all systems are on at initial timing of pwm=h. ss starts charging. when the output voltage is boosted enough, and enough current flows through the led, led_ok signal is switched in the ic. pwm=l from the rise timing of this signal for about 20us during this pwm=l period, led pins with led connections' output voltage becomes 0.2v and above, where as unused led pins are below 0.2v. during this time, determination on whether the led pins are 0.2v above/below is done. after the determination, unused led pins are pulled up to 5v. the auto signal remains l level. in addition, automatic determination of the open decision will only be in ss range, therefore, please set the application so that the step-up/boost be completed before ss> 3.7v. downloaded from: http:///
datasheet datasheet 14/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv ] [ ] [ 15000 ? ? k khz f r sw rt led current setting setting of led output current iled can be made by connecting a resistor riset to the iset pin. ? riset vs. iled current relation equation however, led current setting should be made in the range of 30ma to 150ma. [setting example] to set iled current to 100ma, riset resistance is given by the following equation: dc/dc converter drive frequency setting dc/dc converter drive frequency is determined by making rt resistance setting. ? drive frequency vs. rt resistance (ideal) relation equation [setting example] to set dc/dc drive frequency fsw to 200 khz, rrt is given by the following equation: ] [ ] [ 7500 ? ? k ma i r led iset ] [ 75 ] [ 100 7500 ] [ 7500 ? ? ? ? k ma ma i r led iset where fsw ? dc/dc converter oscillation frequency [khz] this equation has become an ideal equation without any correction item included. for accurate frequency settings, thorough verification should be performed on practical sets. ] [ 75 ] [ 200 15000 ] [ 15000 ? ? ? ? k khz khz f r sw rt (nadim=7~35v) downloaded from: http:///
datasheet datasheet 15/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv ? lsp setting procedure making a change to the lsp pin input voltage will allow the threshold for led short circuit protection to be changed. the led short circuit detection voltage is set to 6v (typ.) with the lsp pin being in the open-circuited state.lsp pin input voltage setting should be made in the range of 0.8v to 3v. the relation between the lsp pin voltage and the led short circuit protection detection voltage is given by the following equation. since the lsp pin divides 3v within the ic using resistive dividers (see the circuit diagram shown below), connecting an external resistor to the lsp pin will produce resistance combined with the internal ic resistance. consequently, to make lsp pin voltage setting using external resistive dividers, it is recommended to connect them having resistance little affected by the internal resistance. (smaller resistance makes the lsp pin increasingly less likely to be affected by the internal resistance, but this results in more power consumption. careful attention should be paid to this matter.) ? lsp detection voltage setting equation if the setting of lsp detection voltage vlsp is made by dividing the reg58 voltage by the use of resistive dividers r1 and r2, vlsp will be given by the following equation: however, this equation includes no internal ic resistance. if internal resistance is taken into account, the detection voltage vlsp will be given by the following equation: make setting of r1 and r2 resistance so that a difference between resistance values found by equations (1) and (2) will come to approximately 2% or less as a guide. [setting example] assuming that lsp is approximated by equation (1) in order to set lsp detection voltage to 6v, r1 comes to 38.3k ? and r2 comes to 10k ? . when calculating lsp detection voltage taking into account internal ic resistance by equation (2), it will be given as: the difference is given as: as a result, this setting will be little affected by internal impedance. ?? % 13.0 100 ][6/][6 ][ 992 .5 ? ? ? ? v v v ? ? ?? ? ? ][ 992 .5 5 ] [ 2000 ] [3.38 ] [ 1000 ] [10 ] [ 1000 ] [10 ] [ 2000 ] [3.38( ] [3.38 ][3 ] [ 2000 ][8.5 ] [ 1000 ] [10 v k k k k k k k k k v k v k k vlsp ? ? ? ?? ? ? ?? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? )1( ][ 5 ] [2 ] [1( ] [2 ][58 ? v k r k r k r v reg led short ? ? ?? ? ? ?? ? ? ? ? ? ? ? ? ? ?? ? ? )2( ][ 5 ] [3 ] [1 ] [4 ] [2 4 2 ] [3 ] [1( ] [1 ][ 3 ][58 ] [4 ] [2 ? v k r k r k r k r r r k r k r k r v ref r v reg k r k r led short ? ? ?? ? ? ?? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ] [ 5 v vlsp led short ? ? downloaded from: http:///
datasheet datasheet 16/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv ovp/scp settings ovp pin is dc/dc output voltages over voltage protection and short circuit protection input pin. ovp pin is a high impedance pin with no pull down resistor. thus, at open state please set the voltage input settings using voltage dividing resistor and such. respective ovp pin protection conditions are as below protection name detection pin detection condition cancellation condition timer operations protection type ovp ovp ovp>3.0v ovp<2.9v no dcdc stops during detection scp ovp ovp<0.1v ovp>0.1v yes all latch ovp detection setting vout abnormally increase voltage detected by ovp, vovp det, r1,r2 settings are as follows ovp cancellation setting r1,r2 set from above equation, ovp cancellation voltage vovp can equals to scp detection setting when r1,r2 are set using values obtained above, scp voltage setting is vscp det is as follows setting example vout at normal operation 56v ovp detection voltage vovp det =68v r2=10k, r1 is as follows when r1, r2 are set at these values, ovp cancellation voltage, vovp can in addition, at this r1, r2, scp detection voltage to select dc/dc components, give consideration to ic variations as well as individual component varia tions, and then conduct thorough veri fication on practical systems. ] [ ][0.3 ]) [0.3 ][ ( ] [2 1 ? ? ? ? ? k v v v vovp k r r det ][ ] [2 ]) [2 ] [1( 9.2 v k r k r k r v vovp can ? ? ? ? ? ? ] [ 7. 216 ][3 ]) [3 ][68( ] [10 ][0.3 ]) [0.3 ][ ( ] [2 1 ? ? ? ? ? ? ? ? ? ? k v v v k v v v vovp k r r det ][ 7.65 ][ ] [10 ] [7. 216 ] [10 ][9.2 ] [2 ]) [2 ] [1( ][9.2 v v k k k v k r k r k r v vovp can ? ? ? ? ? ? ? ? ? ? ? ? ? ][ ] [2 ]) [2 ] [1( 1.0 v k r k r k r v vscp det ? ? ? ? ? ? ][ 27.2 ][ ] [10 ] [7. 216 ] [10 ][1.0 ] [2 ]) [2 ] [1( ][1.0 v v k k k v k r k r k r v vscp det ? ? ? ? ? ? ? ? ? ? ? ? ? downloaded from: http:///
datasheet datasheet 17/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv ? timer latch time setting this ic has a built-in timer latch counter. timer latch time is set by counting the clock frequency which is set at the rt pin. timer latch time when various abnormal conditions happen, counting starts from the timing, latch occurs after below time has passed. furthermore, even if pwm=l, if abnormal condition continues, timer count will not reset. here, latch time = time until latch condition occurs r rt = resistor value connected to rt pin setting example timer latch time when rt=75kohm ][ 10 5.1 ] [ 4096 10 5.1 2 7 10 12 s k r r latch rt rt time ? ? ? ? ? ? ? example of led short protection timing chart ][ 02 .0 10 5.1 ] [ 75 4096 10 5.1 ] [ 4096 7 7 s k k r latch rt time ? ? ? ? ? ? ? ? ? downloaded from: http:///
datasheet datasheet 18/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv ? ocp settings/dcdc components curre nt capacity selection method one of the function of cs pin - when its pin voltage> 0.45 it stops the dcdc. thus, rcs resistor value need to be checked after the peak current flow throug h the inductor is calculated. furthermore, dcdc external components current capacity needs to be greater than peak current flowing through this inductor. inductor peak current ip eak calculation method firstly, ripple voltage which occurs at the cs pin is decided depending on the dcdc application conditions. the conditions when made as below; output voltage=vout[v] led total current=iout[a] dcdc input voltage=vin[v] dcdc efficiency = [%] total required average input current iin: inductor ripple current il[a] which occurs at inductor l[h] during dcdc drive operation with switching frequency=fsw[hz] is as follows therefore, ils peak current ipeak can be calculated using below equation (resistor rcs connected to cs pin selection method) this ipeak flows in rcs and generates voltage. (refer to time chart diagram on the right). this voltage value, vcspeak can be calculated as below this vcspeak when reach 0.45v, will stop the dcdc output. thus when selecting rcs value, below condition needs to be met. (dcdc components current capacity selection method) when ocp reach detection voltage cs=0.45v, iocp current ipeak current (1) i ocp current (2) and components max current capacity needs to satisfy the following above condition needs to be satisfied when selecting dcdc application parts eg. fet, inductor, diode etc. furthermore, continuous mode is recommended for normal dcdc applications. inductors ripple current min limit value, lmin becoming is a condition to be met. if this is not met, it is called discontinuous mode. ][ [%] ][ ][ ][ a v v a i v v i in out out in ? ? ? ? ][ ] [ ][ ] [ ][ ]) [ ][ ( a hz f v v h l v v v v v v il sw out in in out ? ? ? ? ? )1( ][ 2 ][ ][ ? a a il a i ipeak in ? ? ? ] [ v ipeak rcs vcs peak ? ? ? ? ocp peak i i )2( ] [ ] [ ] [45.0 ? a rcs v i ocp ? ? ] [45.0 ] [ ] [ v a ipeak rcs ? ? ? rated current of components 0 ][ 2 ][ ][ im ? ? ? ? a a il a i in in downloaded from: http:///
datasheet datasheet 19/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv setting example output voltage=vout[v]=56v led total current=iout[a]=100ma 4ch=0.40a dcdc input voltage=vin[v]=14v dcdc efficiency= [%]=90% total required average input current iin: when, dcdc switching frequency =fsw[hz]=200khz inductor l[h]=33uh, inductor ripple current il[a]: thus, il peak current ipeak becomes rcs resistor value when set at 0.1ohm and satisfy the condition. in addition ocp detection current i ocp at this time is if parts used (fet,inductor diode etc)s current capacity<5a, thus, there is no problem of parts selection as the above condition is satisfied. in addition il ripple current minimum limit imin is thus will not become discontinuous mode to select dc/dc components, give consideration to ic variations as well as individual component varia tions, and then conduct thorough verification on practical systems. ] [ 78 .1 [%] 90 ] [ 14 ] [ 40 .0 ] [ 56 [%] ] [ ] [ ] [ ] [ a v a v v v a i v v a i in out out in ? ? ? ? ? ? ? ? ] [ 59.1 ] [ 10 200 ] [56 ] [ 10 33 ] [14 ]) [14 ] [56( ] [ ] [ ] [ ] [ ]) [ ] [ ( 3 6 a hz v h v v v hz f v v h l v v v v v v il sw out in in out ? ? ? ? ? ? ? ? ? ? ? ? ? ? ] [ 58.2 2 ] [59.1 ] [78.1 ] [ 2 ] [ ] [ a a a a a il a i ipeak in ? ? ? ? ? ? 0 ] [ 985 .0 ] [ 795 .0 ] [78.1 ] [ 2 ] [ ] [ im ? ? ? ? ? ? ? a a a a a il a i in in v v a ipeak rcs vcs peak 45.0 ] [ 258 .0 ] [ 58.2 ] [ 10.0 ? ? ? ? ? ? ? ] [ 5.4 ] [1.0 ] [45.0 a v i ocp ? ? ? ? ? ocp peak i i rated current of components ] [5 ] [5.4 ] [58.2 a a a ? ? ? peak current calculation result rcs resistor consideration dcdc current capacity consideration downloaded from: http:///
datasheet datasheet 20/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv selection of inductor l the value of inductor has significant influence on the input ripple current. as shown by equation (1), the larger the inductor and the higher the switching frequency, the inductor ripple current ? il becomes increasingly lower. (1) ][ ) ( ????? a f v l v v v il sw out in in out ? ? ? ? ? expressing efficiency as shown by equation (2), peak input current is given as equation (3). (2) ????? in in out out i v i v ? ? ? ? (3) 2 2 ????? il v i v il i il in out out in max ? ? ? ? ? ? ? where, l: reactance value [h], v out : dc/dc output voltage [v], v in : input voltage [v], i out : output load current (total output current) [a], i in : input current [a], and f sw : oscillation frequency [hz] . note: if a current in excess of the rated current of the inductor applies to the coil, the inductor will cause magnetic saturation, resulting in efficiency degradation. select an inductor with an adequate margin so that peak current will not exceed the rated current of the inductor. note: to reduce power dissipation from and increase efficiency of inductor, select an inductor with low resistance component (dcr or acr). selection of output capacitor c out select a capacitor on the output side taking into account the stability region of output voltage and equivalent series resistance necessary to smooth ripple voltage. note that higher output ripple voltage may result in a drop in led pin voltage, making it impossible to supply set led current. the output ripple voltage ? v out is given by equation (4). (4) ][ 1 1 ????? v f i c r ilmax v sw out out esr out ? ? ? ? ? ? where r esr ? equivalent series resistance of c out . note: select capacitor ratings with an adequate margin for output voltage. note: to use an electrolytic capacitor, an adequate margin should be provided for permissible current. particularly to apply pwm light modulation to led, note that a current higher than the set led current transiently flows. selection of switching mosfet transistors there will be no problem for switching mosfet transistors having absolute maximum rating higher than rated current of the inductor l and vf higher than c out breakdown voltage ? rectifier diode. however, to achieve high-speed switching, select transistors with small gate capacity (injected charge amount). note: rated current larger than overcurrent protection setting current is recommended. note: selecting transistors with low on resistance can obtain high efficiency. selection of rectifier diodes select schottky barrier diodes having current capability higher than the rated current of the inductor l and inverse breakdown voltage higher that c out breakdown voltage, particularly having low forward voltage vf. v out v in c out r cs l i l v out v in c out r cs l r esr i l upper: fig.15 inductor current waveform lower: fig.16 dc/dc convertor application circuit (b) fig.17 dc/dc converter application circuit (c) downloaded from: http:///
datasheet datasheet 21/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv phase compensation setting procedure dc/dc converter application for current mode control includes one each of pole f p (phase delay) by cr filer consisting of output capacitor and output resistor (i.e., led current) and zero (phase lead) f z by the output capacitor and capacitor esr. furthermore, the step-up dc/dc converter includes rhp zero f zrhp as the second zero. since the rhp zero has phase delay ( ? 90 ? ) characteristics like the pole, the crossover frequency f c should be set to not more than rhp zero i. find pole f p and rhp zero f zrhp of dc/dc converter. where ? total led current [a], ii. find phase compensation to be inserted in the error amplifier. (set f c to 1/5 of f zrhp .) where iii. find zero used to compensate esr (r esr ) of c out (electrolytic capacitor). note: even if a ceramic capacitor (r esr of the order of milliohms) for c out , it is recommended to insert c fb2 for stable operation. to improve transient response, it is necessary to increase r fb1 and reduce c fb1 . however, this improvement reduces a phase margin. to avoid this problem, conduct thorough verification, including variations in external components, on practical systems. v out vin c out r cs l r esr c fb1 fb r fb1 gm v out i led c fb2 output block error amplifier block ] [ 2 ) 1( 2 hz i l d v f led out zrhp ? ? ? ? ? ? ] [ ) 1( 5 1 ? ? ? ? ? ? ? ? ? d v gm f i r f r out p led cs rhzp fb ] [ 2 1 1 1 f f r c p fb fb ? ? ? ? ] [ 1 2 f r c r c fb out esr fb ? ? ] [ 2 hz c v i f out out led p ? ? ? ? out in out v v v d ? ? ][ 10 0.4 4 s gm ? ? ? led i downloaded from: http:///
datasheet datasheet 22/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv = _ _ __ _ _ timing chart downloaded from: http:///
datasheet datasheet 23/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv list of protect function (typ condition) protection name detection pin detection conditions cancellation conditions protection type detection pin pwm ss led open led ledx < 0.2v h ss>3.7v ledx > 0.2v immediately auto-restart after detection (judge periodically whether normal or not) ledshort led ledx > 5v h ss>3.7v ledx < 5v immediately auto-restart after detection (judge periodically whether normal or not) (lsp=open) (lsp=open) iset gnd short iset under - - above auto-restart iset90% iset90% reg58 uvlo reg58 reg58<2.4v - - reg58>2.6v auto-restart vcc uvlo vcc vcc<7.3v - - vcc>7.5v auto-restart ovp ovp ovp>3.0v - - ovp<2.9v auto-restart scp ovp ovp<0.1v - - ovp>0.1v immediately auto-restart after detection (judge periodically whether normal or not) fb over shoot fb fb>4v - - fb<3.6v immediately auto-restart after detection (judge periodically whether normal or not) ocp cs ocp>0.45v - - - pulse-by-pulse to clear the latch type, stb should be set to l once, and then to h. dc/dc led led open continue to operate only detects led, stops after cp count continue to operate ledshort continue to operate only detects led, stops after cp count continue to operate iset gnd short stop immediately stop immediately continue to operate stb stop immediately stop(and when reg58<2.4v) discharge immediately reg58 uvlo stop immediately stop immediately discharge immediately vcc uvlo stop immediately stop immediately discharge immediately ovp stop immediately (n pin only) continue to operate continue to operate scp stop immediately (n pin only) stop after cp count discharge after cp count fb over shoot stop after cp count stop after cp count continue to operate ocp n pin limits duty stop immediately continue to operate * cp = 20msec (rt=75kohm) downloaded from: http:///
datasheet datasheet 24/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv operational notes 1) we pay utmost attention to the quality control of this product. however, if it exceeds the absolute maximum ratings including applied voltage and operating temperature range, it may lead to its deterioration or breakdown. further, this makes it impossible to assume a breakdown state such as short or open circuit mode. if any special mode to exceed the absolute maximum ratings is assumed, consider adding physical safety measures such as fuses. 2) making a reverse connection of the power supply connector c an cause the ic to break down. to protect the ic form breakdown due to reverse connection, take preventive measures such as inserting a diode between the external power supply and the power supply pin of the ic. 3) since current regenerated by back electromotive force flows back, take preventive measures such as inserting a capacitor between the power supply and the ground as a path of the regenerative current and fully ensure that capacitance presents no problems with characteristics such as lack of capacitanc e of electrolytic capacitors causes at low temperatures, and then determine the power supply line. provide thermal design having an adequate margin in consideration of power dissipation (pd) in the practical operating conditions. 4) the potential of the gnd pin should be maintained at the minimum level in any operating state. 5) provide thermal design having an adequate margin in considerat ion of power dissipation (pd) in the practical operating conditions. 6) to mount the ic on a printed circuit board, pay utmost attention to the direction and displacement of the ic. furthermore, the ic may get damaged if it is mounted in an erroneous manner or if a short circuit is established due to foreign matters entered between output pins or between output pin and power supply gnd pin. 7) note that using this ic in strong magnetic field may cause it to malfunction. 8) this ic has a built-in thermal-protection circuit (tsd circ uit), which is designed to be activated if the ic junction temperature reached 150 ? c to 200 ? c and deactivated with hysteresis of 10 ? c or more. the thermal-protection circuit (tsd circuit) is a circuit absolutely intended to protect the ic from thermal runaway, not intended to protect or guarantee the ic. consequently, do not use the ic based on the activation of this tsd circuit for subsequent continuous use and operation of the ic. 9) when testing the ic on a set board with a capacitor connected to the pin, the ic can be subjected to stress. in this case, be sure to discharge the capacitor for each process. in addition, to connect the ic to a jig up to the testing process, be sure to turn off the power supply prior to connection, and disconnect the jig only after turning off the power supply. 10) this monolithic ic contains p ? isolation and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersections of these p layers and the n layers of other elements, thus making up different types of parasitic elements. for example, if a resistor and a transistor is connected with pins respectively as shown in fig. ? when gnd ? (pin a) for the resistor, or when gnd ? (pin b) for the transistor (npn), p-n junctions operate as a parasitic diode. ? when gnd ? (pin b) for the transistor (npn), the parasitic npn transistor operates by the n layer of other element adjacent to the parasitic diode aforementioned. due to the structure of the ic, parasitic elements are inevitably formed depending on the relationships of potential. the operation of parasitic diodes can result in interferences in circuit operation, leading to malfunctions and eventually breakdown of the ic. consequently, pay utmost attention not to use the ic for any applications by which the parasitic elements are operated, such as applying a voltage lower than that of gnd (p substrate) to the input pin. status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority fig18. example of simple structure of monolithic ic b c e adjacent other elements parasitic (pin b) gnd parasitic element (pin a) parasitic element resistor p substrate n g nd p n p (pin a) p n transistor (npn) b parasitic element gnd e c gnd pp n n n p n p substrate (pin b) downloaded from: http:///
datasheet datasheet 25/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv ordering information b d 9 3 9 4 f p - e 2 part number package fp: hsop20 efv: htssop-b24 packaging and forming specification e2: embossed tape and reel downloaded from: http:///
datasheet datasheet 26/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv physical dimension tape and reel information (hsop20) ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin a. 5.5 ilu. burr draig . downloaded from: http:///
datasheet datasheet 27/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv physical dimension tape and reel information (htssop-b24) ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet datasheet 28/28 tsz02201-0f1f0c100180-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.may.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd9394fp, bd9394efv revision history date revision changes 12.oct.2012 001 new release 09.nov.2012 002 page. 10: add iset pin function 09.may.2014 003 page. 1, 9: revise pin name (agnd gnd) downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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